Flip Chip Package Technology

Course Description

This topic provides an overview of flip chip packaging technology and its evolution over time. In this course, Raghu Chaware will discuss the high-level assembly process steps and key factors that influence yield, quality, and reliability. Additionally, he will also discuss how flip packaging technologies have recently advanced and are being used to significantly improve the performance of FPGAs, CPUs, GPUs, and other application-specific processing units.